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1 ? fn3138.13 hin232, hin236, hin237,hin238, hin239, hin240, hin241 +5v powered rs-232 transmitters/receivers the hin232-hin241 family of rs-232 transmitters/receivers interface circuits meet all ela rs-232e and v.28 specifications, and are particularly suited for those applications where 12v is not available. they require a single +5v power supply (except hin239) and feature onboard char ge pump voltage converters which generate +10v and -10v supplies from the 5v supply. the family of devices offer a wide variety of rs-232 transmitter/receiver combinations to accommodate various applications (see selection table). the drivers feature true ttl/cm os input compatibility, slew- rate-limited output, and 300 ? power-off source impedance. the receivers can handle up to 30v, and have a 3k ? to 7k ? input impedance. the receivers also feature hysteresis to greatly improve noise rejection. features ? meets all rs-232e and v.28 specifications ? requires only single +5v power supply - (+5v and +12v - hin239) ? high data rate. . . . . . . . . . . . . . . . . . . . . . . . . . . 120kbps ? onboard voltage doubler/inverter ? low power consumption ? low power shutdown function ? three-state ttl/cmos receiver outputs ? multiple drivers - 10v output swing for 5v lnput -300 ? power-off source impedance - output current limiting - ttl/cmos compatible -30v/ s maximum slew rate ? multiple receivers - 30v input voltage range -3k ? to 7k ? input impedance - 0.5v hysteresis to improve noise rejection applications ? any system requiring rs-232 communication ports - computer - portable, mainframe, laptop - peripheral - printers and terminals - instrumentation - modems selection table part number power supply voltage number of rs-232 drivers number of rs-232 receivers external components low power shutdown/ttl three-state number of leads hin232 +5v 2 2 4 capacitors no/no 16 hin236 +5v 4 3 4 capacitors yes/yes 24 hin237 +5v 5 3 4 capacitors no/no 24 hin238 +5v 4 4 4 capacitors no/no 24 hin239 +5v and +7.5v to 13.2v 3 5 2 capacitors no/yes 24 hin240 +5v 5 5 4 capacitors yes/yes 44 hin241 +5v 4 5 4 capacitors yes/yes 28 data sheet june 2003 caution: these devices are sensitive to electrosta tic discharge; follow proper ic handling procedures. 1-888-intersil or 321-724-7143 | intersil (and design) is a registered trademark of intersil americas inc. copyright ? intersil americas inc. 2003. all rights reserved. all other trademarks mentioned are the property of their respective owners.
2 pin descriptions pin function v cc power supply input 5v 10%. v+ internally generated positive supply (+10v nom inal), hin239 requires +7.5v to +13.2v. v- internally generated negat ive supply (-10v nominal). gnd ground lead. connect to 0v. c1+ external capacitor (+ termin al) is connected to this lead. c1- external capacitor (- termi nal) is connected to this lead. c2+ external capacitor (+ termin al) is connected to this lead. c2- external capacitor (- termi nal) is connected to this lead. t in transmitter inputs. these leads accept ttl/cmos levels. an internal 400k ? pull-up resistor to v cc is connected to each lead. t out transmitter outputs. these are rs-232 levels (nominally 10v). r in receiver inputs. these inputs accept rs-232 input levels. an internal 5k ? pull-down resistor to gnd is connected to each input. r out receiver outputs. these are ttl/cmos levels. en enable input. this is an active low input which enables the receiver outputs. with en = 5v, the receiver outputs are placed in a high impedance state. sd shutdown input. with sd = 5v, the charge pump is disabled, the receiver outputs are in a high impedance state and the transmitters are shut off. nc no connect. no connections are made to these leads. ordering information part number temp. range ( o c) package pkg. dwg. # hin232cb 0 to 70 16 ld soic m16.3 hin232cb-t 0 to 70 tape and reel hin232cp 0 to 70 16 ld pdip e16.3 hin232ib -40 to 85 16 ld soic m16.3 hin232ip -40 to 85 16 ld pdip e16.3 hin236cb 0 to 70 24 ld soic m24.3 hin236ib -40 to 85 24 ld soic m24.3 hin237cb 0 to 70 24 ld soic m24.3 hin237cb-t 0 to 70 tape and reel hin238cb 0 to 70 24 ld soic m24.3 hin238cb-t 0 to 70 tape and reel hin238cp 0 to 70 24 ld pdip e24.3 hin238ib -40 to 85 24 ld soic m24.3 hin239cb 0 to 70 24 ld soic m24.3 hin239cb-t 0 to 70 tape and reel hin239cp 0 to 70 24 ld pdip e24.3 hin240cn 0 to 70 44 ld mqfp q44.10x10 hin241ca 0 to 70 28 ld ssop m28.209 hin241cb 0 to 70 28 ld soic m28.3 hin241ib -40 to 85 28 ld soic m28.3 hin232, hin236, hi n237, hin238, hin 239, hin240, hin241
3 pinouts hin232 (pdip, soic) top view hin236 (soic) top view 14 15 16 9 13 12 11 10 1 2 3 4 5 7 6 8 c1+ v+ c1- c2+ c2- r2 in t2 out v cc t1 out r1 in r1 out t1 in t2 in r2 out gnd v- t3 out t1 out t2 out r1 in r1 out t2 in t1 in gnd v cc c1+ v+ c1- t4 out r2 out sd en t4 in r3 out v- c2- c2+ r2 in t3 in r3 in 1 2 3 4 5 6 7 8 9 10 11 12 16 17 18 19 20 21 22 23 24 15 14 13 v cc +5v 2 v+ 16 t1 out t2 out t1 in t2 in t1 t2 11 10 14 7 +5v 400k ? +5v 400k ? r1 out r1 in r1 13 12 5k ? r2 out r2 in r2 8 9 5k ? +10v to -10v voltage inverter note 1 6 v- c2+ c2- + note 1 4 5 +5v to 10v voltage doubler c1+ c1- + note 1 1 3 + note 1 + + 1 f 15 note: 1. either 0.1 f or 1 f capacitors may be used. the v+ capacitor may be terminated to v cc or to gnd. 9 v cc +5v to 10v voltage doubler +10v to -10v voltage inverter t1 out t2 out t3 out t4 out t4 in t1 in t2 in t3 in t1 t2 t3 t4 +5v + 1 f + 1 f + 1 f 7 6 2 3 18 1 19 24 10 12 11 15 v+ v- c1+ c1- c2+ c2- +5v 400k ? +5v 400k ? +5v 400k ? +5v 400k ? + 1 f 13 14 r1 out r1 in r1 4 5 5k ? r2 out r2 in r2 23 22 5k ? r3 out r3 in r3 16 17 5k ? en 20 21 sd 8 hin232, hin236, hi n237, hin238, hin 239, hin240, hin241
4 hin237 (soic) top view hin238 (pdip, soic) top view pinouts (continued) t3 out t1 out t2 out r1 in r1 out t2 in t1 in gnd v cc c1+ v+ c1- t4 out r2 out t5 in t5 out t4 in r3 out v- c2- c2+ r2 in t3 in r3 in 1 2 3 4 5 6 7 8 9 10 11 12 16 17 18 19 20 21 22 23 24 15 14 13 t2 out t1 out r2 in r2 out t1 in r1 out r1 in gnd v cc c1+ v+ c1- t3 out r3 out t4 in t4 out t3 in r4 out v- c2- c2+ r3 in t2 in r4 in 1 2 3 4 5 6 7 8 9 10 11 12 16 17 18 19 20 21 22 23 24 15 14 13 9 v cc +5v to 10v voltage doubler +10v to -10v voltage inverter t1 out t2 out t3 out t4 out t4 in t1 in t2 in t3 in t1 t2 t3 t4 +5v + 1 f + 1 f + 1 f 7 6 2 3 18 1 19 24 10 12 11 15 v+ v- c1+ c1- c2+ c2- +5v 400k ? +5v 400k ? +5v 400k ? +5v 400k ? + 1 f 13 14 r1 out r1 in r1 4 5 5k ? r2 out r2 in r2 23 22 5k ? r3 out r3 in r3 16 17 5k ? t5 out t5 in t5 21 20 +5v 400k ? 8 9 v cc +5v to 10v voltage doubler +10v to -10v voltage inverter t1 out t2 out t3 out t4 out t4 in t1 in t2 in t3 in t1 t2 t3 t4 +5v + 1 f + 1 f + 1 f 5 18 2 1 19 24 21 20 10 12 11 15 v+ v- c1+ c1- c2+ c2- +5v 400k ? +5v 400k ? +5v 400k ? +5v 400k ? + 1 f 13 14 r1 out r1 in r1 7 6 5k ? r2 out r2 in r2 3 4 5k ? r3 out r3 in r3 23 22 5k ? r4 out r4 in r4 16 17 5k ? 8 hin232, hin236, hi n237, hin238, hin 239, hin240, hin241
5 hin239 (pdip, soic) top view hin240 (mqfp) pinouts (continued) r1 out r1 in gnd v cc v+ c1+ c1- v- r5 in r5 out r4 out r4 in t1 in r2 out r2 in t2 out t1 out r3 out nc en t3 out t2 in r3 in t3 in 1 2 3 4 5 6 7 8 9 10 11 12 16 17 18 19 20 21 22 23 24 15 14 13 nc gnd nc r2 in nc t2 out t1 out t3 out t4 out r3 in r3 out t5 in nc 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 28 27 26 25 24 23 22 21 20 19 18 39 38 37 36 35 34 33 32 31 30 29 44 43 42 41 40 r4 out t4 in t3 in r5 out r5 in nc nc sd en t5 out r4 in r2 out t2 in t1 in r1 out r1 in v cc nc nc nc nc nc c1+ v+ c1- c2+ c2- v- nc nc nc 4 v cc +10v to -10v voltage inverter t1 out t2 out t3 out t1 in t2 in t3 in t1 t2 t3 +5v + 1 f + 1 f 24 23 19 20 16 13 6 7 5 8 v+ c1+ c1- +5v 400k ? +5v 400k ? +5v 400k ? r1 out r1 in r1 2 5k ? r2 out r2 in r2 21 22 5k ? r3 out r3 in r3 18 17 5k ? r4 out r4 in r4 12 11 5k ? r5 out r5 in r5 9 10 5k ? en 14 1 +7.5v to +13.2v (note) v- 3 (note) note: for v+ > 11v, use c 1 0.1 f. 19 v cc +5v to 10v voltage doubler +10v to -10v voltage inverter t1 out t2 out t3 out t1 in t2 in t3 in t1 t2 t3 +5v + 1 f 1 f + 1 f 15 14 7 8 37 6 25 27 26 30 v+ v- c1+ c1- c2+ c2- +5v 400k ? +5v 400k ? +5v 400k ? + 1 f 28 29 r1 out r1 in r1 17 5k ? r2 out r2 in r2 10 13 5k ? r3 out r3 in r3 4 3 5k ? r4 out r4 in r4 40 39 5k ? r5 out r5 in r5 35 36 5k ? en 42 16 t4 out t4 in t4 38 5 +5v 400k ? t5 out t5 in t5 241 +5v 400k ? sd 43 18 hin232, hin236, hi n237, hin238, hin 239, hin240, hin241
6 hin241 (soic, ssop) top view pinouts (continued) t3 out t1 out t2 out r2 in r2 out t2 in t1 in r1 out r1 in gnd v cc c1+ v+ c1- t4 out r3 out sd en r4 in t4 in r5 out r5 in v- c2- c2+ r3 in r4 out t3 in 28 27 26 25 24 23 22 21 20 19 18 17 16 15 1 2 3 4 5 6 7 8 9 10 11 12 13 14 11 v cc +5v to 10v voltage doubler +10v to -10v voltage inverter t1 out t2 out t3 out t1 in t2 in t3 in t1 t2 t3 +5v + 1 f + 1 f + 1 f 7 6 2 3 20 1 12 14 13 17 v+ v- c1+ c1- c2+ c2- +5v 400k ? +5v 400k ? +5v 400k ? + 1 f 15 16 r1 out r1 in r1 9 5k ? r2 out r2 in r2 4 5 5k ? r3 out r3 in r3 27 26 5k ? r4 out r4 in r4 23 22 5k ? r5 out r5 in r5 18 19 5k ? en 24 8 t4 out t4 in t4 21 28 +5v 400k ? sd 25 10 hin232, hin236, hi n237, hin238, hin 239, hin240, hin241
7 absolute maximum rati ngs thermal information v cc to ground. . . . . . . . . . . . . . . . . . . . . . (gnd -0.3v) < v cc < 6v v+ to ground (note 2) . . . . . . . . . . . . . . . (v cc -0.3v) < v+ < 13.2v v- to ground . . . . . . . . . . . . . . . . . . . . . . .-12v < v- < (gnd +0.3v) v+ to v- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24v input voltages t in . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3v < v in < (v+ +0.3v) r in . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30v output voltages t out . . . . . . . . . . . . . . . . . . . .(v- -0.3v) < v txout < (v+ +0.3v) r out . . . . . . . . . . . . . . . . . (gnd -0.3v) < v rxout < (v+ +0.3v) short circuit duration t out . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . continuous r out . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . continuous operating conditions temperature range hin2xxcx . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 o c to 70 o c hin2xxix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40 o c to 85 o c thermal resistance (typical, note 3) ja ( o c/w) 16 ld pdip package . . . . . . . . . . . . . . . . . . . . . . . . 90 24 ld pdip package . . . . . . . . . . . . . . . . . . . . . . . . 70 16 ld soic package . . . . . . . . . . . . . . . . . . . . . . . . 100 24 ld soic package . . . . . . . . . . . . . . . . . . . . . . . . 75 28 ld soic package . . . . . . . . . . . . . . . . . . . . . . . . 70 28 ld ssop package . . . . . . . . . . . . . . . . . . . . . . . 95 44 ld mqfp package . . . . . . . . . . . . . . . . . . . . . . . 80 maximum junction temperature (plastic package) . . . . . . . .150 o c maximum storage temperature range . . . . . . . . . -65 o c to 150 o c maximum lead temperature (soldering 10s) . . . . . . . . . . . . .300 o c (soic, ssop, mqfp - lead tips only) caution: stresses above those listed in ?abs olute maximum ratings? may cause permanent dam age to the device. this is a stress o nly rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. note: 2. only hin239. for v+ > 11v, c1 must be 0.1 f. 3. ja is measured with the component mounted on a low effective ther mal conductivity test board in free air. see tech brief tb379 fo r details. electrical specifications test conditions: v cc = +5v 10%, t a = operating temperature range parameter test conditions min typ max units supply currents power supply current, i cc no load, t a = 25 o c hin232 - 5 10 ma hin236-hin238, hin240-hin241 - 7 15 ma hin239 - 0.4 1 ma v+ power supply current, i cc no load, t a = 25 o c no load, t a = 25 o c hin239 - 5.0 15 ma shutdown supply current, i cc (sd) t a = 25 o c-110 a logic and transmitter inputs, receiver outputs input logic low, v ll t in , en , shutdown - - 0.8 v input logic high, v lh t in 2.0 - - v en , shutdown 2.4 - - v transmitter input pullup current, i p t in = 0v - 15 200 a ttl/cmos receiver output voltage low, v ol i out = 1.6ma - 0.1 0.4 v ttl/cmos receiver output voltage high, v oh i out = -1.0ma 3.5 4.6 - v receiver inputs rs-232 input voltage range v in -30 - +30 v receiver input impedance r in v in = 3v 3.0 5.0 7.0 k ? receiver input low threshold, v ln (h-l) v cc = 5v, t a = 25 o c0.81.2-v receiver input high threshold, v in (l-h) v cc = 5v, t a = 25 o c-1.72.4v receiver input hysteresis v hyst 0.2 0.5 1.0 v hin232, hin236, hi n237, hin238, hin 239, hin240, hin241
8 detailed description the hin232 thru hin241 family of rs-232 transmitters/receivers are powered by a single +5v power supply (except hin239), feat ure low power consumption, and meet all ela rs-232c and v.28 specifications. the circuit is divided into three sections: the charge pump, transmitter, and receiver. charge pump an equivalent circuit of the charge pump is illustrated in figure 1. the charge pump cont ains two sections: the voltage doubler and the voltage inverter. each section is driven by a two phase, internally generated clock to generate +10v and -10v. the nominal clock frequency is 16khz. during phase one of the clock, capacitor c1 is charged to v cc . during phase two, the voltage on c1 is added to v cc , producing a signal across c3 equal to twice v cc . during phase one, c2 is also charged to 2v cc , and then during phase two, it is inverted with respect to ground to produce a signal across c4 equal to -2v cc . the charge pump accepts input voltages up to 5.5v. the output impedance of the voltage doubler section (v+) is approximately 200 ? , and the output impedance of the voltage inverter section (v-) is approximately 450 ? . a typical application uses 1 f capacitors for c1-c4, however, the value is not critical. increasing the values of c1 and c2 will lower the output impedance of the voltage doubler and inverter, increasing the values of the reservoir capacitors, c3 and c4, lowers the ripple on the v+ and v- supplies. during shutdown mode (hin236 , hin240 and hin241), shutdown control line set to logic ?1?, the charge pump is turned off, v+ is pulled down to v cc , v- is pulled up to gnd, and the supply current is reduced to less than 10 a. the transmitter outputs are disabled and the receiver outputs are placed in the high impedance state. timing characteristics baud rate (1 transmitter switching) r l = 3k ? 120 - - kbps output enable time, t en hin236, hin239, hin240, hin241 - 400 - ns output disable time, t dis hin236, hin239, hin240, hin241 - 250 - ns propagation delay, t pd rs-232 to ttl - 0.5 - s instantaneous slew rate sr c l = 10pf, r l = 3k ? , t a = 25 o c (note 4) - - 30 v/ s transition region slew rate, sr t r l = 3k ? , c l = 2500pf measured from +3v to -3v or -3v to +3v, 1 transmitter switching -3-v/ s transmitter outputs output voltage swing, t out transmitter outputs, 3k ? to ground 5 9 10 v output resistance, t out v cc = v+ = v- = 0v, v out = 2v 300 - - ? rs-232 output short circuit current, i sc t out shorted to gnd - 10 - ma note: 4. guaranteed by design. electrical specifications test conditions: v cc = +5v 10%, t a = operating temperature range (continued) parameter test conditions min typ max units + - c1 + - c3 + - c2 + - c4 s1 s2 s5 s6 s3 s4 s7 s8 v cc gnd rc oscillator v cc gnd v+ = 2v cc gnd v- = -(v+) c1 + c1- c2 - c2 + voltage inverter voltage doubler figure 1. charge pump hin232, hin236, hi n237, hin238, hin 239, hin240, hin241
9 transmitters the transmitters are ttl/cmos compatible inverters which translate the inputs to rs-232 out puts. the input logic threshold is about 26% of v cc , or 1.3v for v cc = 5v. a logic 1 at the input results in a voltage of between -5v and v- at the output, and a logic 0 results in a voltage between +5v and (v+ -0.6v). each transmitter input has an internal 400k ? pullup resistor so any unused input can be left unconnected and its output remains in its low state. the output voltage swing meets the rs-232c specifications of 5v minimum with the worst case conditions of: all transmitters driving 3k ? minimum load impedance, v cc = 4.5v, and maximum allowable operating temperature. the transmitters have an internally limited output slew rate which is less than 30v/ s. the outputs are short circuit protected and can be shor ted to ground indefinitely. the powered down output impedance is a minimum of 300 ? with 2v applied to the outputs and v cc = 0v. receivers the receiver inputs accept up to 30v while presenting the required 3k ? to 7k ? input impedance even if the power is off (v cc = 0v). the receivers have a typical input threshold of 1.3v which is within the 3v limits, known as the transition region, of the rs-232 specific ations. the receiver output is 0v to v cc . the output will be low whenever the input is greater than 2.4v and high whenever the input is floating or driven between +0.8v and -30v . the receivers feature 0.5v hysteresis to improve noise re jection. the receiver enable line en , when set to logic ?1?, (hin236, 239, 240, and 241) disables the receiver outputs, placing them in the high impedance mode. the receiver outputs are also placed in the high impedance state when in shutdown mode. t out v- < v tout < v+ 300 ? 400k ? t xin gnd < t xin < v cc v- v+ v cc figure 2. transmitter r out gnd < v rout < v cc 5k ? r xin -30v < r xin < +30v gnd v cc figure 3. receiver t in v ol v ol t plh t phl average propagation delay = t phl + t plh 2 or r in t out or r out figure 4. propagation delay definition hin232, hin236, hi n237, hin238, hin 239, hin240, hin241
10 typical performance curves figure 5. v- supply voltage vs v cc , varying capacitors figure 6. v+, v- output voltage vs load (hin232) 12 10 8 6 4 2 0 3.5 4.0 4.5 6.0 v cc v- supply voltage 5.0 5.5 3.0 0.10 f 0.47 f 1 f 35 |i load | (ma) v+ (v cc = 4.5v) v- (v cc = 4.5v) t a = 25 o c transmitter outputs open circuit 30 25 20 15 10 5 0 supply voltage (|v|) 0 12 10 8 6 4 2 v+ (v cc = 5v) v- (v cc = 5v) test circuits (hin232) figure 7. general test circuit figure 8. power-off source resistance configuration 14 15 16 9 13 12 11 10 1 2 3 4 5 7 6 8 c1+ v+ c1- c2+ c2- v- r2 in t2 out v cc t1 out r1 in r1 out t1 in t2 in r2 out gnd +4.5v to +5.5v input 3k ? t1 output rs-232 30v input ttl/cmos output ttl/cmos input ttl/cmos input ttl/cmos output + - 1 f c3 + - 1 f c1 + - 1 f c2 + - 1 f c4 3k ? output rs-232 30v input t2 14 15 16 9 13 12 11 10 1 2 3 4 5 7 6 8 c1+ v+ c1- c2+ c2- v- r2 in t2 out v cc t1 out r1 in r1 out t1 in t2 in r2 out gnd t2 out t1 out v in = 2v a r out = v in /1 hin232, hin236, hi n237, hin238, hin 239, hin240, hin241
11 applications the hin2xx may be used for all rs-232 data terminal and communication links. it is partic ularly useful in applications where 12v power supplies are not available for conventional rs-232 interface circuits. the applications presented represent typical interface configurations. a simple duplex rs-232 port with cts/rts handshaking is illustrated in figure 9. fixed output signals such as dtr (data terminal ready) and dsrs (data signaling rate select) is generated by driving them through a 5k ? resistor connected to v+. in applications requiring four rs-232 inputs and outputs (figure 10), note that each ci rcuit requires two charge pump capacitors (c1 and c2) but can share common reservoir capacitors (c3 and c4). the benefit of sharing common reservoir capacitors is the elimination of two capacitors and the reduction of the charge pump source impedance which effectively increases the outpu t swing of the transmitters. - + - + - + dtr (20) data terminal ready dsrs (24) data signaling rate rs-232 inputs and outputs td (2) transmit data rts (4) request to send rd (3) receive data cts (5) clear to send signal ground (7) 15 8 13 7 14 16 - + 6 r2 r1 t2 t1 9 12 10 11 4 5 3 1 hin232 c1 1 f c2 1 f td rts rd cts select +5v inputs and outputs ttl/cmos figure 9. simple duplex rs-232 port with cts/rts handshaking 2 figure 10. combining two hin232s for 4 pairs of rs-232 inputs and outputs - + rs-232 inputs and outputs dtr (20) data terminal ready dsrs (24) data signaling rate select dcd (8) data carrier detect r1 (22) ring indicator signal ground (7) 15 8 13 7 14 2 - + 4 r2 r1 t2 t1 9 12 10 11 3 1 hin232 c1 1 f dtr dsrs dcd r1 +5v inputs and outputs ttl/cmos - + - + td (2) transmit data rts (4) request to send rd (3) receive data cts (5) clear to send 8 13 7 14 15 r2 r1 t2 t1 9 12 10 11 4 5 3 1 hin232 c1 1 f c2 1 f td rts rd cts inputs and outputs ttl/cmos - + 5 c2 1 f 16 c3 2 f 6 2 6 v- v+ - + c4 2 f 16 hin232, hin236, hi n237, hin238, hin 239, hin240, hin241
12 die characteristics die dimensions 160 mils x 140 mils metallization type: al thickness: 10k ? 1k ? substrate potential v+ passivation type: nitride over silox nitride thickness: 8k ? silox thickness: 7k ? transistor count 238 process cmos metal gate metallization mask layout hin240 t3 out t1 out t2 out r2 in r2 out t2 in t1 in r1 out r1 in gnd v cc c1+ v+ c1- t4 out r3 out en r4 in t4 in r5 out v- c2- c2+ r3 in r4 out t3 in r5 in shutdown t5 out t5 in hin232, hin236, hi n237, hin238, hin 239, hin240, hin241
13 hin232, hin236, hi n237, hin238, hin 239, hin240, hin241 dual-in-line plastic packages (pdip) notes: 1. controlling dimensions: inch. in case of conflict between english and metric dimensions, the in ch dimensions control. 2. dimensioning and tolerancing per ansi y14.5m - 1982. 3. symbols are defined in the ?mo series symbol list? in section 2.2 of publication no. 95. 4. dimensions a, a1 and l are measured with the package seated in je- dec seating plane gauge gs - 3. 5. d, d1, and e1 dimensions do not include mold flash or protrusions. mold flash or protrusions shal l not exceed 0.010 inch (0.25mm). 6. e and are measured with the leads constrained to be perpendic- ular to datum . 7. e b and e c are measured at the lead tips with the leads unconstrained. e c must be zero or greater. 8. b1 maximum dimensions do not include dambar protrusions. dambar protrusions shall not exceed 0.010 inch (0.25mm). 9. n is the maximum number of terminal positions. 10. corner leads (1, n, n/2 and n/2 + 1) for e8.3, e16.3, e18.3, e28.3, e42.6 will have a b1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm). e a -c- c l e e a c e b e c -b- e1 index 12 3 n/2 n area seating base plane plane -c- d1 b1 b e d d1 a a2 l a1 -a- 0.010 (0.25) c a m bs e16.3 (jedec ms-001-bb issue d) 16 lead dual-in-line plastic package symbol inches millimeters notes min max min max a - 0.210 - 5.33 4 a1 0.015 - 0.39 - 4 a2 0.115 0.195 2.93 4.95 - b 0.014 0.022 0.356 0.558 - b1 0.045 0.070 1.15 1.77 8, 10 c 0.008 0.014 0.204 0.355 - d 0.735 0.775 18.66 19.68 5 d1 0.005 - 0.13 - 5 e 0.300 0.325 7.62 8.25 6 e1 0.240 0.280 6.10 7.11 5 e 0.100 bsc 2.54 bsc - e a 0.300 bsc 7.62 bsc 6 e b - 0.430 - 10.92 7 l 0.115 0.150 2.93 3.81 4 n16 169 rev. 0 12/93
14 hin232, hin236, hi n237, hin238, hin 239, hin240, hin241 dual-in-line plastic packages (pdip) notes: 1. controlling dimensions: inch. in ca se of conflict between english and metric dimensions, the in ch dimensions control. 2. dimensioning and tolerancing per ansi y14.5m - 1982. 3. symbols are defined in the ?mo series symbol list? in section 2.2 of publication no. 95. 4. dimensions a, a1 and l are m easured with the package seated in jedec seating plane gauge gs - 3. 5. d, d1, and e1 dimensions do not include mold flash or protrusions. mold flash or protrusions shal l not exceed 0.010 inch (0.25mm). 6. e and are measured with the leads constrained to be perpendic- ular to datum . 7. e b and e c are measured at the lead tips with the leads unconstrained. e c must be zero or greater. 8. b1 maximum dimensions do not in clude dambar protrusions. dambar protrusions shall not exceed 0.010 inch (0.25mm). 9. n is the maximum number of terminal positions. 10. corner leads (1, n, n/2 and n/2 + 1) for e8.3, e16.3, e18.3, e28.3, e42.6 will have a b1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm). e a -c- c l e e a c e b e c -b- e1 index 12 3 n/2 n area seating base plane plane -c- d1 b1 b e d d1 a a2 l a1 -a- 0.010 (0.25) c a m bs e24.3 (jedec ms-001-af issue d) 24 lead narrow body dual-in-line plastic package symbol inches millimeters notes min max min max a - 0.210 - 5.33 4 a1 0.015 - 0.39 - 4 a2 0.115 0.195 2.93 4.95 - b 0.014 0.022 0.356 0.558 - b1 0.045 0.070 1.15 1.77 8 c 0.008 0.014 0.204 0.355 - d 1.230 1.280 31.24 32.51 5 d1 0.005 - 0.13 - 5 e 0.300 0.325 7.62 8.25 6 e1 0.240 0.280 6.10 7.11 5 e 0.100 bsc 2.54 bsc - e a 0.300 bsc 7.62 bsc 6 e b - 0.430 - 10.92 7 l 0.115 0.150 2.93 3.81 4 n24 249 rev. 0 12/93
15 hin232, hin236, hi n237, hin238, hin 239, hin240, hin241 small outline plast ic packages (soic) notes: 1. symbols are defined in the ?mo series symbol list? in section 2.2 of publication number 95. 2. dimensioning and tolerancing per ansi y14.5m - 1982. 3. dimension ?d? does not include mold flash, protrusions or gate burrs. mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. dimension ?e? does not include inte rlead flash or protrusions. interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. the chamfer on the body is optional. if it is not present, a visual index feature must be located within the crosshatched area. 6. ?l? is the length of terminal for soldering to a substrate. 7. ?n? is the number of terminal positions. 8. terminal numbers are shown for reference only. 9. the lead width ?b?, as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch) 10. controlling dimension: millimeter. converted inch dimensions are not necessarily exact. index area e d n 123 -b- 0.25(0.010) c a m bs e -a- l b m -c- a1 a seating plane 0.10(0.004) h x 45 o c h 0.25(0.010) b m m m16.3 (jedec ms-013-aa issue c) 16 lead wide body small outline plastic package symbol inches millimeters notes min max min max a 0.0926 0.1043 2.35 2.65 - a1 0.0040 0.0118 0.10 0.30 - b 0.013 0.0200 0.33 0.51 9 c 0.0091 0.0125 0.23 0.32 - d 0.3977 0.4133 10.10 10.50 3 e 0.2914 0.2992 7.40 7.60 4 e 0.050 bsc 1.27 bsc - h 0.394 0.419 10.00 10.65 - h 0.010 0.029 0.25 0.75 5 l 0.016 0.050 0.40 1.27 6 n16 167 0 o 8 o 0 o 8 o - rev. 0 12/93
16 hin232, hin236, hi n237, hin238, hin 239, hin240, hin241 small outline plast ic packages (soic) notes: 1. symbols are defined in the ?mo series symbol list? in section 2.2 of publication number 95. 2. dimensioning and tolerancing per ansi y14.5m - 1982. 3. dimension ?d? does not include mold flash, protrusions or gate burrs. mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. dimension ?e? does not include in terlead flash or protrusions. inter- lead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. the chamfer on the body is optional. if it is not present, a visual index feature must be located within the crosshatched area. 6. ?l? is the length of terminal for soldering to a substrate. 7. ?n? is the number of terminal positions. 8. terminal numbers are shown for reference only. 9. the lead width ?b?, as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch) 10. controlling dimension: millimete r. converted inch dimensions are not necessarily exact. index area e d n 123 -b- 0.25(0.010) c a m bs e -a- l b m -c- a1 a seating plane 0.10(0.004) h x 45 o c h 0.25(0.010) b m m m24.3 (jedec ms-013-ad issue c) 24 lead wide body small outline plastic package symbol inches millimeters notes min max min max a 0.0926 0.1043 2.35 2.65 - a1 0.0040 0.0118 0.10 0.30 - b 0.013 0.020 0.33 0.51 9 c 0.0091 0.0125 0.23 0.32 - d 0.5985 0.6141 15.20 15.60 3 e 0.2914 0.2992 7.40 7.60 4 e 0.05 bsc 1.27 bsc - h 0.394 0.419 10.00 10.65 - h 0.010 0.029 0.25 0.75 5 l 0.016 0.050 0.40 1.27 6 n24 247 0 o 8 o 0 o 8 o - rev. 0 12/93
17 hin232, hin236, hi n237, hin238, hin 239, hin240, hin241 small outline plast ic packages (soic) notes: 1. symbols are defined in the ?mo series symbol list? in section 2.2 of publication number 95. 2. dimensioning and tolerancing per ansi y14.5m - 1982. 3. dimension ?d? does not include mo ld flash, protrusions or gate burrs. mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. dimension ?e? does not include in terlead flash or protrusions. in- terlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. the chamfer on the body is optional . if it is not present, a visual index feature must be located within the crosshatched area. 6. ?l? is the length of terminal for soldering to a substrate. 7. ?n? is the number of terminal positions. 8. terminal numbers are shown for reference only. 9. the lead width ?b?, as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch) 10. controlling dimension: millimeter. converted inch dimen- sions are not necessarily exact. index area e d n 123 -b- 0.25(0.010) c a m bs e -a- l b m -c- a1 a seating plane 0.10(0.004) h x 45 o c h 0.25(0.010) b m m m28.3 (jedec ms-013-ae issue c ) 28 lead wide body small outline plastic package symbol inches millimeters notes min max min max a 0.0926 0.1043 2.35 2.65 - a1 0.0040 0.0118 0.10 0.30 - b 0.013 0.0200 0.33 0.51 9 c 0.0091 0.0125 0.23 0.32 - d 0.6969 0.7125 17.70 18.10 3 e 0.2914 0.2992 7.40 7.60 4 e 0.05 bsc 1.27 bsc - h 0.394 0.419 10.00 10.65 - h 0.01 0.029 0.25 0.75 5 l 0.016 0.050 0.40 1.27 6 n28 287 0 o 8 o 0 o 8 o - rev. 0 12/93
18 hin232, hin236, hi n237, hin238, hin 239, hin240, hin241 shrink small outline plastic packages (ssop) notes: 1. symbols are defined in the ?mo seri es symbol list? in section 2.2 of publication number 95. 2. dimensioning and tolerancing per ansi y14.5m - 1982. 3. dimension ?d? does not include mo ld flash, protrusions or gate burrs. mold flash, protrusion and gate burrs shall not exceed 0.20mm (0.0078 inch) per side. 4. dimension ?e? does not include inte rlead flash or protrusions. inter- lead flash and protrusions shall not exceed 0.20mm (0.0078 inch) per side. 5. the chamfer on the body is optional. if it is not present, a visual in- dex feature must be located within the crosshatched area. 6. ?l? is the length of terminal for soldering to a substrate. 7. ?n? is the number of terminal positions. 8. terminal numbers are shown for reference only. 9. dimension ?b? does not include dam bar protrusion. allowable dam- bar protrusion shall be 0.13mm (0.005 inch) total in excess of ?b? dimension at maximum material condition. 10. controlling dimension: millimete r. converted inch dimensions are not necessarily exact. index area e d n 123 -b- 0.25(0.010) c a m bs e -a- l b m -c- a1 a seating plane 0.10(0.004) c h 0.25(0.010) b m m 0.25 0.010 gauge plane a2 m28.209 (jedec mo-150-ah issue b) 28 lead shrink small outline plastic package symbol inches millimeters notes min max min max a - 0.078 - 2.00 - a1 0.002 - 0.05 - - a2 0.065 0.072 1.65 1.85 - b 0.009 0.014 0.22 0.38 9 c 0.004 0.009 0.09 0.25 - d 0.390 0.413 9.90 10.50 3 e 0.197 0.220 5.00 5.60 4 e 0.026 bsc 0.65 bsc - h 0.292 0.322 7.40 8.20 - l 0.022 0.037 0.55 0.95 6 n28 287 0 o 8 o 0 o 8 o - rev. 1 3/95
19 all intersil products are manufactured, asse mbled and tested utilizing iso9000 quality systems. intersil corporation?s quality certif ications can be viewed at webs ite www.intersil.com/quality/iso.asp . intersil products are sold by description only. intersil corporat ion reserves the right to make changes in circuit design and/o r specifications at any time without notice. accordingly, the reader is cautioned to verify that data sheets are current before placing orders. information furnished by int ersil is believed to be accurate and reliable. how- ever, no responsibility is assumed by intersil or its subsidiaries for its use; nor for any infringements of patents or other r ights of third parties whic h may result from its use. no license is granted by implication or otherwise under any patent or patent rights of intersil or its subsidiaries. for information regarding intersil corporation and its products, see web site www.intersil.com hin232, hin236, hi n237, hin238, hin 239, hin240, hin241 metric plastic quad flatpack packages (mqfp) d d1 e e1 -a- pin 1 a2 a1 a 12 o -16 o 12 o -16 o 0 o -7 o 0.40 0.016 min l 0 o min plane b 0.005/0.009 0.13/0.23 with plating base metal seating 0.005/0.007 0.13/0.17 b1 -b- e 0.008 0.20 a-b s d s c m 0.076 0.003 -c- -d- -h- q44.10x10 (jedec ms-022ab issue b) 44 lead metric plastic quad flatpack package symbol inches millimeters notes min max min max a - 0.096 - 2.45 - a1 0.004 0.010 0.10 0.25 - a2 0.077 0.083 1.95 2.10 - b 0.012 0.018 0.30 0.45 6 b1 0.012 0.016 0.30 0.40 - d 0.515 0.524 13.08 13.32 3 d1 0.389 0.399 9.88 10.12 4, 5 e 0.516 0.523 13.10 13.30 3 e1 0.390 0.398 9.90 10.10 4, 5 l 0.029 0.040 0.73 1.03 - n44 447 e 0.032 bsc 0.80 bsc - rev. 2 4/99 notes: 1. controlling dimension: millimeter. converted inch dimensions are not necessarily exact. 2. all dimensions and toleranc es per ansi y14.5m-1982. 3. dimensions d and e to be determined at seating plane . 4. dimensions d1 and e1 to be determined at datum plane . 5. dimensions d1 and e1 do not include mold protrusion. allowable protrusion is 0.25mm (0.010 inch) per side. 6. dimension b does not include dambar protrusion. allowable dambar protrusion shall be 0.08mm (0.003 inch) total. 7. ?n? is the number of terminal positions. -c- -h-

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